Application of Inkjet printing for 3D integration

Eiroma, Kim; Viljanen, Heikki
The Society for Imaging Science and Technology, IS&T, 2015
A4 Artikkeli konferenssijulkaisussa

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Dixit, Pradeep; Viljanen, Heikki; Salonen, Jaakko; Molarius, Jyrki; Monnoyer, Philippe
IEEE Institute of Electrical and Electronic Engineers, 2013
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High-performance barrier films for flexible organic display and lighting applications

Kimmel, Jyrki; Nikkola, Juha; Räsänen, Lea; Willberg-Keyriläinen, Pia; Viljanen, Heikki; Paajanen, Mika
SID International Symposium: Digest of Technical Papers, Wiley, 2015
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Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Vuorinen, Vesa; Ross, Glenn; Viljanen, Heikki; Decker, James; Paulasto-Krockel, Mervi
2018
A4 Artikkeli konferenssijulkaisussa